chip scale packaging การใช้

Chip scale package ( CSP ) is another packaging technology.
This package is similar to chip scale packages ( CSP ) in construction.
Wafer-level chip scale packaging ( WL-CSP ) is one of the smallest packages currently available on the market and is produced by OSATs, such as Advanced Semiconductor Engineering ( ASE ).
During this same time, companies began to look at reducing or streamlining their packaging, from the earlier multi-chip-on-ceramic packages that IBM had originally developed C4 to support, to what were referred to as Chip Scale Packages ( CSP ).
In July 2009, Nemotek Technologie announced a new WLP technology, which provides a true chip scale package with only 400om as the minimum thickness . and delivers based on Through Silicon Via ( TSV ) technology, providing customers with thin, reliable, and more sophisticated imaging components for applications including mobile camera phones, mobile computers and other mobile devices used in medical or automotive.